Bi-Layered Model of Interfacial Thermal Stresses with the Effect of Different Temperatures in the Layers

Abstract

An interfacial shearing and peeling stress model is proposed to account for different uniform temperatures and thickness wise linear temperature gradients in the layers. This upgraded model can be viewed as a more generic form to determine interfacial stresses under different temperature conditions in a bi-layered assembly. The selected shearing and peeling stress results are presented for the case of die and die attach as commonly seen in electronic packaging. The obtained results can be useful in interfacial stress evaluations and physical design of bi-material assemblies, which are used in microelectronics and photonic applications.