Abstract
Thermo-mechanical mismatch stress is one of the reasons for mechanical as well as functional failure between two or more connected devices. In electronic packaging, two or more plates or layers are bonded together by an extremely thin layer. This thin bonding layer works as an interfacial stress compliance which is expected to alleviate the interfacial stresses between the layers. Therefore, it is very important to identify the suitable interfacial bonding characteristics for reducing the interfacial thermal mismatch stresses to maintain the structural integrity. This research work examines the influences of bond layer properties and geometry on the interfacial shearing and peeling stresses in a bi-material assembly. In this study a closed form model of bi-layered assembly is used with the up-to-date bond layer shear stress compliance expression. The key bond layer properties namely Young’s modulus, coefficient of thermal expansion, Poisson’s ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation. It is observed that the Young’s modulus, the thickness and the temperature of the bond layer have significant influence on the interfacial shearing and peeling stress. The results obtained are likely to be useful in designing bond layer properties in microelectronics and photonics applications.
Highlights
Interfacial thermal stresses are induced due to the mismatches of thermal, stiffness and other properties caused by the dissimilar materials
The key bond layer properties namely Young’s modulus, coefficient of thermal expansion, Poisson’s ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation
The results obtained are likely to be useful in designing bond layer properties in microelectronics and photonics applications
Summary
Interfacial thermal stresses are induced due to the mismatches of thermal, stiffness and other properties caused by the dissimilar materials. This mismatch of properties is often unavoidable due to the functional requirement of the materials in the package This induced thermo-mechanical mismatch stress is one of the main causes of mechanical and functional failure in electronic and photonic devices. In electronic packaging, two or more materials are bonded together by an extremely thin interfacial stress compliant attachment This bond material can provide appreciable buffering effect which can lead to a substantial relief in thermally induced stresses in various adhesively bonded or soldered assemblies in electronics and photonics [8,9] Selection of bond material properties and thickness should be addressed at the physical design stage for optimum mechanical performance of the device. The key bond layer properties namely Young’s modulus, coefficient of thermal expansion, Poisson’s ratio, and physical parameters like temperature and thickness are considered for interfacial stress evaluation
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