Abstract
Experimental study has been performed on evaporation of water droplet on a copper surface. This surface is exposed by the Plasma irradiation to increase the wettability. We measured the relation between the Plasma irradiation and contact angle first, and then the evaporation time, the wetting limit temperature and Leidenfrost point of droplet, increasing the surface temperature. The effect of Plasma irradiation on evaporation curve has been examined. It is found that the evaporation time decreases, and wetting limit temperature and Leidenfrost point increases as the contact angel decreasces.
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