Abstract
Purpose – The development of micro‐electro‐mechanical systems (MEMS) for use in military and consumer electronics necessitates an analysis of MEMS component reliability. The understanding of the reliability characteristics of SCSi within MEMS structures should be improved to advance MEMS applications. Reliability assessments of MEMS technology may be used to conduct virtual qualification of these devices more efficiently. The purpose of this paper is to create a simple, inexpensive test methodology to use the dynamic fracture strength of a MEMS device to predict its reliability, and to verify this method through experimentation.
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