Abstract
A finely focused ion beam system is described. Beams of Ga, In, and Au ions emitted from a liquid metal ion source are routinely focused to spot diameters of ∼0.1 to 3.0 μm at a current density of ∼0.5 A/cm 2 and a beam energy of 20 keV. Focused beams with energies of 1 to 30 keV have also been produced. Three applications are discussed: (1) scanning ion microscopy, (2) mask repair, and (3) ion beam lithography. Scanning ion images illustrating topographic and chemical contrast are presented. The repair of opaque and clear defects in optical masks, and opaque defects in X-ray masks is shown.Defects are imaged with the ion beam and removed by sputter erosion. Edge reconstruction of 0.5 μm features is demonstrated. Most repairs take less than 10 s/μm 2. The advantages and limitations of ion beams for lithography are discussed.
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