Abstract
In this study, we proposed a novel technology for developing a nanoscale, high-resolution, and cost-efficient next-generation semiconductor process that uses exposure technology with ultraviolet-light-emitting diode (UV-LED) arrays and poly(dimethylsiloxane) (PDMS) flexible soft mold imprint technology in order to develop a vacuum-assisted photoresist filling technology for microstructures. By integrating the characteristics of the PDMS soft mold, photocure resist, and vacuum-assisted filling system to fabricate waveguide components, conformal contact was obtained between a PDMS soft mold and a substrate surface, at a low surface free energy. The vacuum-assisted filling system was used to achieve compact and complete photoresist filling. There is no residual layer left after filling and a subsequent process is no longer necessary; thus, cost and process time can be effectively reduced. Recently, nanometer component manufacturing technology and its applications have become more sophisticated.
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