Abstract

Limited by light source wavelength and light diffraction, nanostructure fabrication is tough, but it needs multiple special and expensive processes (e.g.: E-beam). The common problems are complex and slow processing, expensive manufacturing equipment and material, and it is very unsuitable for mass production; therefore, itpsilas of utmost importance to develop a nanoscale, high resolution and cost efficient next generation semiconductor process. This study integrated PDMS soft mold, photo resist(SU-8 2035) and vacuum pumping equipment, as well as researched and developed a vacuum-assisted photo resistant microstructure filling technique, and combined soft mold to fabricate waveguide microstructure. Conformal contact was obtained between PDMS soft mold and substrate surface, with low surface free energy, and resistance of sticking to resist in filling.Vacuum equipment was used to enable compact and complete resistant filling, and it can not only greatly increase the effective filling area, but, without residue after filling. There is no need for post treatment removing of the residual layer; it can well lower cost and reduce process time, so that the microstructure component manufacturing technique and application can be more mature.

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