Abstract
To date, solder has been a crucial component for interconnecting circuit boards (PCBs) and electronic components in the electronics industry. However, solder faces certain challenges, such as cracking due to thermal changes. This paper investigates solder cracking under thermal expansion. We employ a phase field model to study crack propagation under thermal stress in a square domain and in solder with a fillet shape. The model is based on those proposed by Takaishi-Kimura and Alfat, where the stress and strain tensors are modified to account for variations in the temperature field. In this study, we consider the solder material to be viscoelastic, while the other materials are treated as homogeneous and isotropic. A numerical example is computed using the adaptive mesh finite element method, with the code implemented in FreeFEM software. The results of this study are in good agreement with previous numerical and experimental findings.
Published Version
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