Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

Abstract

This paper presents the antenna-integrated glass interposer for D-band 6G wireless applications using die embedding technology. We implement the die-embedded package on glass substrates and characterize the electrical performance in D-band. The electrical characterization employs embedded test dies with 50 Ω Ground-Signal-Ground (GSG) ports and coplanar waveguides. We achieve low-loss die-to-package transitions by using staggered dielectric vias, which are compared with the transitions of wire-bonding and flip-chip assembly. The paper provides detailed information on the design, modeling, fabrication, and characterization of the die-to-package interconnects. This paper also demonstrates the integration of microstrip patch antenna array and embedded dies in D-band. The results show superior electrical performance provided by the die-embedded glass interposer. The die-to-package interconnect exhibits good matching (less than -10 dB S11) and low loss (0.2 dB loss) in D-band. The integrated 1 × 8 patch antenna array shows 11.6 dB broadside gain and good matching with the embedded die. Additionally, by using a temporary carrier, the antenna-integrated glass interposer also has great potential for further heterogeneous integration and thermal management.