Annealing studies of Be-implanted GaAs0.6P0.4

Abstract

Differential resistivity and Hall effect measurements and secondary ion mass spectrometry (SIMS) are used to study the annealing behavior of Be-implanted GaAs0.6P0.4. Results similar to that previously reported for Be-implanted GaAs are observed, including outdiffusion of Be into the Si3N4 encapsulant during 900‡C annealing of high dose implants. Nearly all (85–100%) of the Be remaining after a 900‡C, 1/2 hr anneal is electrically active. However, the electrical activation at low annealing temperatures (600–700‡C) is much lower in GaAs0.6P0.4 than in GaAs. A substantial amount of diffusion is observed even for the low fluence Be implants in GaAs0.6P0.4 annealed at 900‡C, indicating a greater dependence of the diffusion on defect-related effects in the ternary.