Abstract
The support spring of a uniaxial micro-tensile system for testing micro-scale thin films is studied in this paper. Stresses of different shape springs are analyzed with the finite element method (FEM). The simulated results show that the stress of an S-shaped spring is lower compared with a U-shaped spring with the same dimensions (100 µm thick, 100 µm wide, 250 µm inner diameter and 5 turns). The maximum stress of the S-shaped spring is about 133 MPa when the displacement of 100 µm is imposed at one end of the spring along the lateral side. The number of turns has the most important effect on stress and stiffness of the S-shaped spring. Moreover, main stress concentration is symmetric in the spring system and it is located in the arc near to the two fixed ends in all springs. The spindle-shape support spring is fabricated by UV-LIGA technology according to analyzed results and calibrated by the specific device.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call