Analysis of Crosstalk Effects for Ternary Logic MWCNT Bundled Through Silicon Vias

Abstract

This article presents a technique to improve the crosstalk effects in ternary coupled through silicon vias (TSVs). The effects of crosstalk are investigated in TSVs using multi walled carbon nanotube (MWCNT) as metallic liner and polymers such as polyimide, polypropylene carbonate (PPC), benzocyclobutene (BCB) as dielectric liners. The circuit model for coupled TSVs driven by ternary inverter is utilized to analyze the various crosstalk issues. The HSPICE tool is utilized to develop the proposed TSVs. The crosstalk issues for the MWCNT TSVs are investigated and compared to single walled CNT (SWCNT) TSVs. Moreover, the power, power delay product (PDP) and energy delay product (EDP) are analyzed and compared to SWCNT TSVs. All the performances are also studied for different TSV pitches. The coupled TSVs with BCB show high performance for the large pitch values. Moreover, it is noticed that the coupled TSVs with BCB at 5000 μm TSV pitch improved the performance up to 40.03% over the SWCNT TSVs.