Design of MWCNT based Through Silicon Vias with Polymer Liners to Reduce the Crosstalk Effects

Abstract

This paper presents a unique method to reduce the crosstalk noise, power consumption, power delay product (PDP) and energy delay product (EDP) in coupled multi-walled carbon nanotube (MWCNT) based through silicon vias (TSVs) with polymer liners. A novel structure of TSVs is proposed, where the MWCNT bundles are placed as conducting material and polymer liners are placed as dielectric material. The electrical equivalent model of the proposed TSVs is used and simulated in HSPICE to evaluate the performance. The performance analysis determines that there is a significant improvement in crosstalk noise, power consumption, PDP and EDP for polymer liners such as polyimide, polypropylene carbonate (PPC) and benzocyclobutene (BCB) over the conventional silicon dioxide (SiO2) liner. Moreover, the performance is also analyzed by varying the pitch between the TSVs from 100 μm to 3000 μm. It is noted that the induced crosstalk noise issues are reduced as the TSV pitch is increased. Similarly, the power consumption, PDP and EDP of the proposed TSVs are also reduced for the high pitch value. From the simulation results, it is observed that the proposed MWCNT TSVs with BCB liner show improvements up to 18.01%, 35.37% and 49.06%, respectively in terms of power consumption, PDP and EDP over the TSVs with SiO2 liner.