Abstract
Pin void is one of the key factors affecting the reliability of intelligent power module. It is difficult to accurately identify and measure whether it is a pin void and its size through X-ray equipment. This paper investigates the pin void analytical method of high voltage intelligent power module. An effective combinatorial analysis method is provided. Besides, pin void is compared and studied with different situations of reflow soldering, pin pressure bar and pin type in this research. The effects of different situations of these parameters on pin void are evaluated.
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