High Performance SiC Power Module Based on Repackaging of Discrete SiC Devices

Abstract

Increased adoption of electric vehicles (EV), photovoltaic (PV), and battery energy storage systems (BESS) is driving the need for high-current SiC power modules. The state-of-the-art multichip module is substantially more expensive than the IGBT module. This paper proposes a cost-effective packaging methodology for high-power SiC intelligent power modules (IPMs) with discrete SiC devices. The proposed IPM integrates the gate drivers, decoupling capacitors, snubbers, discrete SiC devices, direct bond copper (DBC), base plate, temperature sensors, and overcurrent protection circuits, achieving very low loop inductance and thermal resistance, and more than 50% cost reduction. A 1200V/480A/2.15mΩ half-bridge IPM is presented for comparison with commercial counterparts. A 1200V/240A/4.3mΩ six-phase IPM is developed, and its performance is experimentally verified.