Abstract
Experimental and numerical analyses on the solder joint reliability of plastic ball grid array under harsh random vibration were presented. The chips were assembled on the daisy chained circuit boards for the test samples preparation, and a half of the samples were processed for underfill to investigate the underfill effects on the solder failures. Two consequential steps of the random vibrations, named as acceptance and qualification levels, were applied. Overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32.1 Grms, respectively. It was found that the samples did not show any solder failure during the tests, demonstrating the robustness of the packaging structure for potential avionics and space applications. Finite element analyses were performed to calculate the sample vibration behaviors and the solder stresses, and the results were compared with the test data.
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