Abstract
A new analytical expression of thermal diffusion coefficient DT is derived. To the firstorder approximation, it is given by (1+η)-1(D/Tn) rather than (1–η)(D/Tn) where η=–(Tn/η*)(∂η*/∂Tn ) and η* represents the temperature-dependent bulk mobility. This new transport coefficient is implemented in our 2-D hydrodynamic device simulator and it seems to produce more reasonable results.
Highlights
Since the original derivation of hot-carrier transport model by Stratton [1], there has been controversy about what the proper transport coefficient of the thermal diffusion current density is [2,3,4,5]
In the hydrodynamic (HD) transport model, in addition to the diffusion current due to the carrier density gradient, there is a thermal diffusion current driven by the carrier temperature gradient
The purpose of this paper is to provide an analytical expression for the thermal diffusion coefficient which is more consistent with Monte Carlo (MC)
Summary
Since the original derivation of hot-carrier transport model by Stratton [1], there has been controversy about what the proper transport coefficient of the thermal diffusion current density is [2,3,4,5]. In the hydrodynamic (HD) transport model, in addition to the diffusion current due to the carrier density gradient, there is a thermal diffusion current driven by the carrier temperature (or energy) gradient. The thermal diffusion current is often in opposite direction to the carrier diffusion current. Improper use of the thermal diffusion coefficient in the HD transport model often affects the outcome of device simulation result. The purpose of this paper is to provide an analytical expression for the thermal diffusion coefficient which is more consistent with Monte Carlo (MC)
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