Abstract

In this contribution we present results on the structural and electrical properties of amorphous REScO 3 ( RE = La, Gd, Tb, Sm) and LaLuO 3 thin films. The study reveals that these oxides are potential candidates for so-called higher- k dielectrics for forthcoming MOSFET generations. High dielectric constants up to 32, low leakage currents and low interface trap densities are determined for amorphous thin films prepared by pulsed-laser deposition, molecular beam deposition and e-gun evaporation. Moreover, we show that LaLuO 3 gate stacks annealed up to 1050 °C maintain low leakage current densities without substantial EOT increase. Finally, promising results for n-MOSFETs with GdScO 3 as gate dielectric processed on strained silicon-on-insulator substrates are also shown.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.