Abstract
The influences of Mo nanoparticles on the growth of intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints during aging were investigated. The results reveal that Mo nanoparticles can significantly refine Ag3Sn grains and inhibit Cu6Sn5 layer thickening, which is very beneficial to the reliability of solder joints. The aging resistance originated from Mo nanoparticles is explained by diffusion theory.
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