Abstract
The continued growth in mobile data traffic is pushing for new and innovative solutions. Over the next few years, cellular phones, tablets, and computers will switch to 5G wireless technology. In this work, an highly integrated WiGig/802.11ad compliant 16+16 beam forming transceiver RFIC with advanced FOWLP (fan out wafer level packaging) technology known as eWLB (embedded wafer level BGA) is presented, which supports the need for the increased demand of data traffic. The 0.5mm pitch eWLB package measures 12.6x12.6x0.8mm and is using advanced dielectric materials and 2 metal layers for the redistribution layers (RDL). Full-wave electromagnetic simulations were performed including models of the chip layout, interconnects on the RDL, transitions and PCB. JEDEC level reliability was tested for component level reliability including MSL, TC, uHAST and HTS. The measurement results of compressed output power and noise figure for both bare die and packaged chip are presented.
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