Advanced Glass Carriers for Buildup Structure Warp Control and Wafer Ultra-thinning

Abstract

Tailorable CTE of glass carriers enables effective warp control of buildup structures such as fan-Out wafer level package and multi-layer laminates. Corning’s Advanced Packaging Carrier (APC) product family covers CTE from 4.9-12.6 ppm/C with fine granularity down to 0.2 ppm/C, and other glass types go down in CTE all the way to 0 ppm/C. We illustrate the benefits of having such CTE capabilities using several use cases. Carrier supported wafer thinning down to single digit microns is another emerging need. In addition to CTE matching, such ultra-thinning requires the carrier and the associated temporary bonding method to deliver very low total thickness variation (TTV), typically a small fraction of the final wafer thickness. We will introduce Corning’s recently announced ultra-low-TTV (ULTTV) glass carriers as well as near-zero-TTV temporary bonding methods that enable ultra-thinning of wafers of various types.