Abstract
Delamination at the resin-copper interface is fully characterized during operative conditions by adopting a combined experimental and numerical approach. Peeling and four-point bending fracture tests are used along with cohesive zone models to reach this purpose. The promising findings are beneficial to analyze the crack propagation at the interface during package-oriented reliability tests, and may therefore be employed to enhance these interfaces in microelectronic plastic packages.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Published version (
Free)
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
