Additively Manufactured Extreme Temperature Electronics Packaging

Abstract

Abstract There is growing interest in extreme temperature electronics to support the mission needs to sense, actuate, and communicate at temperatures beyond the normal range of operations in commercial and military applications. Reliable packaging in the temperature range of more than 300°C has been demonstrated using ceramic multi-chip modules using conventional hybrid circuit technology. This approach typically requires high NRE costs and lead time. Additive manufacturing processes of metals, ceramics, conductors, and dielectrics provides a digital transformation of hybrid circuit manufacturing technology that reduces time and cost for packaging with the added benefits of novel 3D structures and embedded features. This report presents the results of testing to characterize important electrical and mechanical properties of additively manufactured packaging materials (substrates, conductor, dielectrics) and die interconnect methods needed for 300 to 750 °C electronic packaging designs.