Addition polyimides. IV. Effect of structure on thermal characteristics

Abstract

AbstractChain extension reaction of bis(m‐maleimido phenyl) methyl phosphine oxide (BP) with 4,4′‐diaminodiphenylmethane (BP–M), 4,4′‐diaminodiphenyl ether (BP–E), 3,3′‐ and 4,4′‐diaminodiphenyl sulfone (BP–DDSm and (BP‐DDSm respectively), tris (m‐aminophenyl) phosphine oxide (BP–TAP), and 9,9‐bis(p‐aminophenyl) fluorene (BP–BAF) was carried out by refluxing 1:0.3 molar solution of BP:diamine. The melting temperature and exothermic peak associated with curing of BP decreased by such chain extension. The thermogravimetric analysis indicated more than 60% residual weight at 800°C in nitrogen atmosphere in BP–DDSm, BP–DDSp, and BP–TAP resins. These resins can be processed at low temperature and can be used for fabrication of composites with improved properties.