Abstract
A method is proposed for active technological control and management of the deposition of thin conductive films, which makes it possible to obtain films of a given and uniform thickness over its entire surface. In the control method, wire resistive witnesses are used as primary measuring transducers, which are installed in specified areas of the molecular flow of the sprayed substance. Wire resistive witnesses change resistance depending on the thickness of the film deposited on them. In the process of deposition, according to information from wire witnesses, the molecular flow from the evaporator in certain areas is blocked by electromechanical shutters, which ensures uniform thickness of the deposited film. Experimental verification of the developed method and the system implementing it showed a decrease in the spread of film thickness over the entire surface of the substrate from 7 to 2 % on average.
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