Accurate electromagnetic analysis for multilayered interconnect structures based on VSIEs

Abstract

Electromagnetic analysis for multilayered interconnect structures is carried out by integral equation approach in which volume-surface integral equations (VSIEs) are used. The conducting interconnects are described with surface integral equations (SIEs) whereas the dielectric substrates are governed by volume integral equations (VIEs). The VSIEs are usually solved by the method of moments (MoM) with the basis functions requiring conforming meshes. We propose a novel scheme to discretize the VSIEs by combining the traditional MoM for the SIEs and a point-matching method for the VIEs. The VSIEs can improve the conditioning of system matrix and the point-matching method can remove the restraint of conforming meshes. A typical numerical example is used to demonstrate the approach and good result has been obtained.