Fast Analysis of Interconnect Structures Based on Volume-Surface Integral Equations

Abstract

Electromagnetic property of interconnect structures is described by volume-surface integral equations (VSIEs) in an integral equation approach. The VSIEs are conventionally solved by the method of moments (MoM) which requires conforming meshes to define Rao-Wilton-Glisson (RWG) and Schaubert-Wilton-Glisson (SWG) basis functions. We propose a hybrid scheme to solve the VSIEs in which the MoM with the RWG basis function is used to discretize the surface integral equation (SIE) for conducting parts while a point-matching scheme is employed to discretize the volume integral equations (VIEs) for penetrable parts. The interconnect structures are strongly of multiscale feature and the fast analysis method has not been well addressed. We incorporate the hybrid method with multilevel fast multipole algorithm (MLFMA) to accelerate the solution of VSIEs for the interconnect structures and a numerical example is provided to demonstrate the approach.