Abstract
Abstract A tool has been developed that supports a novel microelectronic integration paradigm whereby interconnects between components are directly established by way of micro-coax wirebonds. A near term use-case of the tool is to facilitate rapid prototyping of high-bandwidth systems. When further matured, it will lead to the ability to rapidly integrate complex systems with hundreds or thousands of interconnects with minimal design time. Automatic stripping and bonding of coax wires having overall diameters between 50 to 150μm presents an array of process challenges that pose interesting demands on the material system of the wire and the bonding tool. This paper will review a micro-coax bonding system that is currently in development at Draper which is able to strip, feed and bond micro coax wire. The system utilizes a combination of electric-flame-off (EFO) and thermal reflow to strip outer metal shielding and polymer dielectric layers respectively. It leverages a rotary wire feed mechanism to precisely control wire position so that pre-determined wire-lengths can be established. Progress in design of the wires, tooling and software control architecture are reviewed.
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