Abstract
A two dimensional (2D) dynamic cellular automata (CA) model is presented for photoresist etching process simulation for the first time. In the dynamic CA model, only boundary cells are processed in pertinent etch step, so the simulation speed is greatly increased. The model has been tested using some well-known etch-rate distribution test functions and is found to be stable even in areas where the fluctuation in etch rates is very sharp.
Full Text
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call