A Systematic Approach to the Reliability Characterization of System in Package (SiP)

Abstract

Abstract System-in-Package (SiP) solutions are gaining popularity across multiple market segments, dually reducing product design complexity for Original Equipment Manufacturers (OEMs) while increasing system performance and functionality. For SiP customers, product design complexity is reduced with the integration of electrical sub-system functionality into a module that can be designed into a product with relative ease. Further, logistical complexity is reduced, with the supplier carrying responsibility for the sub-system's quality and reliability. In addition, OEMs benefit from the performance, functionality and form factor improvements enabled by advanced SiP packaging and substrate technologies. With the increased responsibility of SiP solutions in mind, the authors addressed a systematic approach and methodology to understand the complexity of thermo-mechanical risk and challenges in SiP solutions. A modeling and characterization methodology was used to systematically identify and mitigate reliability risks for system-in-package SiP modules. Specifically, a combination of Shadow-Moire technique, digital image correlation (DIC), reliability testing and finite element (FE) models were used to demonstrate this upstream thermo-mechanical evaluation for SiP Solutions. Empirical warpage trends for the SiP module and solder joint fatigue failure trends were in close agreement with the model output based upon design and material factor inputs to the FE models.