Abstract
The design and implementation of a resurfed high-voltage NMOS device in a low-voltage 0.8 μm BiCMOS technology is reported in this paper. Because of its full compatibility with existing technology, the high-voltage NMOS device can be fabricated with low-voltage circuitry on the same chip without requiring any additional processing steps. Two-dimensional process and device simulations were used to design the device. While shorter channel lengths are technologically feasible, 1.5 μm was found to be the minimum drawn channel length to prevent channel punchthrough. Depending on the drift region length (2.8–16 μm), breakdown voltages and specific on-resistances in the ranges of 70–124 V and 1.6–19 mΩ cm 2, respectively, were obtained on experimental test devices with a channel length of 1.5 μm.
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