Abstract
A novel synthetic process for multi-porous polyimide(PI)/poly(methyl silsesquioxane)(PMSSQ)hybrid material has been studied via supercritical CO2technology. The end groups of PI precursors were modified by coupling agent to be hybridized with alkoxysilanes and became PMSSQ precursors. PI/PMSSQ hybrid precursor solution was spun on a silicon wafer substrate for film formation. The PI precursor segment was imidized and micro-pores were developed by removal of by-product, CO2via supercritical CO2media. The PMSSQ precursor segment was cured and nano-pores were generated by supercritical extraction. Average micro-pore size and nano-pore size were 10 μm and 40 nm respectively. The dielectric constant of the multi-porous PI/PMSSQ hybrid film was calculated to 2.5.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call