A new hybrid circuit topology for simultaneous bidirectional signaling over on-chip interconnects

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This work presents a new hybrid circuit topology for simultaneous bidirectional signaling over on-chip interconnects in a multi-channel signaling environment. The proposed hybrid circuit topology transmits the outbound signal and simultaneously receives the inbound signal from the combined sign al, which is a superposition of the outbound and inbound signals, thanks to the echo cancellation circuitry integrated into the hybrid topology. The echo cancellation circuitry cancels the outbound signal, called the replica signal from the super-imposed signal on the channel. The replica signal is generated in the hybrid circuit without the need for a separate replica circuit stage. This work is implemented in 1.1 V, 65-nm CMOS technology. The performance results shows that the proposed hybrid circuit operates at a data rate of 16-Gb/s/ch over a 3 mm on-chip interconnect of width 2 μm in a eight parallel channel environment and it achieves an transmitted signal swing of 520 mV and a received signal swing of 100 mV for a power consumption of 24.6 mW.