Abstract
A simple model is proposed for the evaluation of crack-arrest fracture toughness KIc0 of thin films by Vickers indentation. This approach applies to films thinner than the penetration depth of the Vickers indenter. The model equations are provided in closed form, even though they are so complex that they must be integrated numerically in practical applications. The problem of the evaluation of KIc0 for thin films and substrates is derived in general form and applied to three cases: (i) evaluation of KIc0 for the film in the case that the depth of the crack in the film is smaller than the film thickness, (ii) evaluation of KIc0 for the film in the case that the crack emanating from the film either crosses the film/substrate interface or is stopped by it, (iii) evaluation of KIc0 for the substrate in the case that the crack emanating from the film crosses the film/substrate interface. The model was tested with original and literature experimental data: (i) revision KIc0 values of electroless Ni-P thin films were re-evaluated, (ii) KIc0 of electroless Ni-P thin films of various thickness with various loads were measured (original data) and computed, (iii) KIc0 of electroless Ni-P substrates coated with electrodeposited Au-Cu were measured (original data) and computed.
Published Version
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