Abstract
This paper presents a miniaturized Q-band substrate integrated waveguide (SIW) bandpass filter (BPF) on a silicon-based wafer-level packaging (WLP) process. By incorporating capacitive quasi-coplanar waveguide (CPW) feeding structures and complementary split-ring resonators (CSRRs), the SIW operates in an evanescent-mode below the lower cutoff frequency and then achieves miniaturization. The efficient conversion of wave-modes, mutual excitation among multiple capacitive structures, and extremely short transmission paths, collectively resulting in the proposed BPF exhibiting low insertion loss. Furthermore, the area of fabricated filter has been reduced by 88.96 % compared to the requirement of the cutoff frequency. The measured results show that the minimum insertion loss is 1.24 dB, the return loss is better than 15 dB, and the 3 dB passband covers from 29.6 to 47.8 GHz (FBW is 47 %). These results indicate that, the proposed filter effectively solve the issues of large areas in SIW filters and high losses in silicon-based integrated or packaging processes.
Published Version
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