An left handed material on Si CMOS chip with wafer level package process

Abstract

This paper presents a left-handed material microstrip transmission line on Si CMOS chip using wafer level package (WLP) process. The left- handed materials (LHM) of the novel structure extend from 0.01 GHz to 20 GHz, performing in much wider bandwidth than those reported so far. Composite right/left-handed material (CRLH TL) microstrip line consists of metal-insulator-metal (MIM) capacitors, microstrip transmission lines (TLs) and inductors fabricated by the wafer level package (WLP) process, and it performs as a high-pass filter. The proposed structure is more compact in size and exhibits better insertion and return loss characteristics around the design frequency. The compactness and broad left-handed operation make the proposed left-handed material be well incorporated with Si CMOS RF/Microwave applications.