Abstract
This paper presents a sharp interface formulation for modelling diffusional phase transformations. Grain boundary motion is, in accordance with diffusional phase transformation kinetics, determined by the amount of flux towards the interface and is formulated in a level set framework. This approach enables a computational efficiency that can be expected to be higher than what can be achieved with conventional phase field methods. Compatibility of the interfaces is obtained through an interface reconstruction process, in which the locations of triple junction points are also determined. To ensure local equilibrium and a continuous chemical potential across the interfaces, the chemical composition is prescribed at the phase interfaces. The presented model is used to study the growth of the intermetallic compound (IMC) Cu6Sn5 for a system with Sn electroplated on a Cu substrate. A finite strain formulation is incorporated into the model to investigate the effects of the volume change resulting from the IMC formation. In this formulation, the Cu and Sn phases are allowed to deform plastically. The numerical simulations demonstrate IMC growth rates in agreement with experimental measurements. Moreover, the IMC evolves into a scallop-like morphology, consistent with experimental observations.
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