A Kriging Surrogate Model for Ball Grid Array Electronic Packaging with Stochastic Material and Geometrical Parameters

Abstract

Abstract Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment of automobiles is more complex compared to other applications, primarily due to vibrations generated by power engines and oscillations caused by pavement roughness. The resonant frequencies of electronic packaging structures play a crucial role in system reliability and safety. However, accurately describing the implicit relationship between system resonant frequencies and material and geometrical parameters can be challenging. A Kriging surrogate model (KSM) is proposed by the combination of the Latin Hypercube stochastic sampling with finite element computation. Four different BGA configurations are established with either the initial values in the deterministic model or the specified sampling interval ranges in the stochastic model. The results of the finite element model for BGA electronic packaging are validated and demonstrate qualitative agreement with published literature. The impacts of material and geometrical parameters on the resonant frequencies are investigated and compared. The mean, maximum, minimum, and variance are recorded based on a large database of stochastic samples. The feasibility of KSM for the resonant frequency prediction of BGA is confirmed by its satisfactory accuracy and computational efficiency.