Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?

Abstract

Abstract Finite element simulations are broadly utilized to calculate the thermally induced mechanical deformations of interconnecting solder materials in electronics. The Anand unified viscoplasticity model is a prevalent choice for simulating the mechanical responses of solder joints, comprising nine parameters whose individual effects are not fully addressed in the literature. For this reason, this study examines the influence of each Anand parameter on the mechanical response of leadless Tin-Silver-Copper solder alloys with varying silver content through comprehensive nonlinear finite element simulations. Anand model coefficients for different SAC alloys, including SAC105, SAC205, SAC305, and SAC405, were sourced from existing literature and used to establish a systematic study matrix for each parameter. These coefficients were then integrated into thermomechanical simulations to induce inelastic deformations in the solder interconnections. The response of the solder interconnects is analyzed using equivalent inelastic strains and inelastic strain energy density. Results indicated that specific Anand parameters could skew the solder joint stress-strain response towards brittle behavior, while other parameters could lead to a more ductile response. Through statistical factorial analysis, the significance of each parameter is found to vary considerably, ranging from negligible to highly significant. The findings of this study are crucial for understanding the behavior of different SAC solder configurations and their expected thermal fatigue performance based on Anand creep constants. Furthermore, this paper provides foundational insights into the interpretation of Anand coefficients and their influence on the mechanical response of solder materials, a topic not yet explored in the existing literature.