Abstract
Double sided polishers are commonly used for industrial applications, such as lapping of silicon substrates and chemical mechanical planarization (CMP) of rigid disks. Whereas a kinematic analysis of a single sided polisher, extensively used for IC wafer CMP, is well known, available sources of such an analysis are limited for a double sided polisher, due to its more complicated design. The present work demonstrates a kinematic analysis for obtaining trajectory and relative velocity of a single location on a work piece during double side polishing. Relative velocity is used to calculate travel distance to be compared with the amount removed experimentally obtained. This paper presents mathematical derivation of the analysis and its effectiveness/limitations in conjunction with comparison between the analytical and experimental results.
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