Abstract
Any detailed discussion of high performance packaging for the next generation electronics systems must include both hybrid wafer scale integration (H-WSI) and monolithic wafer scale integration (M-WSI). A H-WSI circuit is a multichip module (MCM) that contains 20-50 chips with at least ten times the maximum functionality that can be readily achieved in one complex chip. A M-WSI circuit is a monolithic semiconductor (silicon generally) chip that contains a large number of cells that in total contain at least ten times the functionality that can be readily achieved in one complex chip. These devices could be called a system on a chip. This paper describes the driving forces behind WSI technologies, defines where the H-WSI technologies are today and forecasts where these are likely to evolve to in the future.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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