Abstract
Functional yield in the hybrid approach to wafer scale integration (HWSI) is a product of the individual component yields in the HWSI assembly, including the contributions from the interconnection substrate and the pretested ICs mounted onto the substrate, and of the assembly processes employed to construct the HWSI circuit or module. The authors report process characterization and yield results for a high interconnection density silicon substrate technology, and for wire bonding and flip chip solder bonding chip connection technologies that are being developed to support HWSI module construction. The design of a SPARC CPU circuit module for parallel computing applications that uses this technology is also described. >
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