Abstract

This paper presents multi-chip temperature sensing technique with simple identification circuits for system in package (SiP) application, to monitor temperature of each functional chip on a system package substrate. The temperature sensor is activated by a simple decoding circuit, and then sends back the temperature dependent pulse. Moreover, by using the BUS topology the control unit connects every sensor chips with only two wires to transceive data, and the routing complexity will not be increased with increased the number of sensor chips. This circuit has implemented in 0.18 μm CMOS process, chip area is 0.02 mm2.

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