Abstract

Liquid crystal polymer (LCP) is a promising substrate for electronics packaging. In this paper, the high frequency characteristics of LCP were investigated using a microstrip ring resonator to verify the possibility of the application of the material in microwave packaging. A GaAs MMIC switch circuit was fabricated using LCP as substrate to demonstrate an application of this material for system in a package. From the high frequency measurements, it is shown that LCP has low dielectric constant and low loss tangent that make it useable in high frequency packaging.

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