Abstract

This paper presents a 5.8 GHz low noise amplifier (LNA) for electronic toll collection system (ETCS). Traditional design strategy of source inductor feedback amplifier (L-CSLNA) ignores the influence of off chip matching, such as print circuit broad (PCB), bonding wire and passive chip parts which greatly affect the performance of LNA at high frequency. In this paper we adopt 3D electromagnetic simulation to analyze the impacts of off chip components to the design of LNA. The proposed LNA has been fabricated in 0.18 μm CMOS process. The measured S11 of the proposed LNA is less than −10 dBm from 5.7 to 5.9 GHz, the minimal noise figure (NF) is 2 dB, the maximal power gain is 12.7 dB and the IIP3 is −4 dBm with 16 mW power dissipation.

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