A 3D System-in-Package for RF Applications

Abstract

Abstract A novel 3D packaging technology of substrate-based platform – double side module is introduced in this paper. This technology is capable of integrating RF front-end module with the advantage of package size reduction, excellent warpage control, and enhanced reliability. System in Package allows system designers to differentiate their products from others by integrating more functions to meet markets' requirement. It can also reduce the complexity of HW design while meeting their device / system requirements. The RF SiP is inherently heterogeneous integrated, for the foundry technologies of the dice inside could include digital CMOS, RF CMOS, III-V, piezoelectric, and other. In the era of 5G, new frequency bands of connected devices and denser component population have led to a demand for aggressive size reduction of RF FEM packaging solutions with good reliabilities and thermal management. The highly integrated 5G (under 6GHz) modem and RF FEM structure are crucial for modern premium tier smart phones' success, and are always a big challenge in the packaging industry due to its highly requirement of performance and manufacture yield.