Abstract
The design of a new general-purpose monolithic power amplifier functional block is described and the flexibility of the block in various applications is discussed. The effects of thermal coupling on the die between components in high-gain dc power amplifiers are examined and a technique is presented for the analytical evaluation of dc circuit performance in the presence of these thermal interactions. Experimental results from the 15-W amplifier are presented. A new integrated power transistor structure is described that includes emitter degeneration resistors as part of the emitter structure. Circuit performance is summarized.
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