Abstract
High density assembly results in evident thermal coupling effect among chips in MCM. Junction temperature is decided by self-heating effect and thermal coupling effect. It can be accurately calculated by using the thermal resistance matrix. This paper focused on thermal coupling effect and presented heat conduction routes and thermal resistance model of three different MCM (lateral-chip, stacked-chip and lateral-and-stacked chip). Based on linear superposition theory, the thermal resistance matrix was established by FEA simulation, the model of calculating junction temperature was obtained by thermal resistance matrix. The model was verified by infrared thermal imaging equipment and the relative error was less than 2%.
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