Abstract
A review of the background to electroless copper deposition, basic electroless copper plating procedures, methods for evaluating the mechanical and electrical properties of electroless copper deposit, and the numerical simulation methods for the electroless copper plating process is presented. The history of printed circuit boards (PCBs) is introduced followed by the application of electroless copper deposition in the PCB industry and ultra/very large-scale integration. Following that, the testing methods of mechanical properties, mainly thermal shock resistance, are summarised. In the last part, computer simulation of the electroless copper plating process is reviewed, including simulation based on a diffusion model.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
