Abstract

This chapter shows the surface morphology evolution of the deposits from different plating solutions, and reveals the different growing process of the deposits. Diamond pyramid structures are discovered on some low temperature deposits. These diamond pyramid structures consist of pure copper. The morphology of the electroplated copper film on the substrate side includes numerous small voids scattering across the surface of the deposit, with relatively large cracks at some portions. No voids are in the deposit on the solution side. In the electroless copper deposits, the granular particles developed on the heat-treated deposit are the most intensive.

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